Mae arddangosiadau LED traw bach yn boblogaidd iawn yn y farchnad gyfredol ac yn cael eu defnyddio'n eang mewn amrywiol feysydd. Maent yn gweithredu fel dyfeisiau arddangos sgrin diffiniad uchel ac yn gwasanaethu pobl. Heddiw, bydd golygydd Winbond Ying yn mynd â chi i ddeall sawl technoleg pecynnu ar gyfer arddangosiadau LED traw.
Arddangosfa LED traw bach
1. Mownt wyneb (SMD)
The surface mount (SMD) package is to solder single or multiple LED chips on a metal bracket with a plastic "cup" outer frame (the outer pins of the bracket are connected to the P and N levels of the LED chip respectively). It is potted with liquid epoxy resin or organic silicone, then baked at high temperature, and then cut and separated into individual surface mount packaged devices.
2. Y dechnoleg pecynnu integredig newydd IMD (pedwar mewn un)
LED display companies have a deep technical accumulation of SMD placement process, and the "four-in-one" package is a further development based on the inheritance of SMD packaging. The SMD package contains one pixel in one package structure, while the "four-in-one" package contains four pixels in one package structure. Although the four-in-one LED display adopts the new integrated packaging technology IMD (four-in-one), the surface mount technology is still used in the process.
The "four-in-one" Mini LED module IMD package combines the advantages of SMD and COB, and solves the problems of ink color consistency, splicing, light leakage, and maintenance. It has the characteristics of high contrast, high integration, easy maintenance, and low cost. It is a better compromise on the road to smaller spacing. At present, "four-in-one" Mini LED modules use formal chips for cost considerations. As packaging manufacturers make more requirements for chips, they will further introduce "six-in-one" or even "N-in-one". "plan.
Arddangosfa LED traw bach
3. technoleg pecynnu COB
Mae pecynnu COB yn ffordd o gysylltu'r sglodion noeth â'r swbstrad rhyng-gysylltu â glud dargludol neu an-ddargludol, ac yna perfformio bondio gwifren i wireddu ei gysylltiad trydanol. Mae pecynnu COB yn defnyddio technoleg pecynnu integredig, oherwydd mae'n arbed un ddyfais LED, ac yna'n gosod y broses ar ôl pecynnu. Gall ddatrys problemau sgriniau arddangos wedi'u pecynnu SMD yn effeithiol, oherwydd bod y cae dot yn crebachu, mae anhawster y broses yn cynyddu, mae'r gyfradd cynnyrch yn cael ei leihau, ac mae'r gost yn cynyddu. COB yn haws i gyflawni lleiniau bach.
